uses universally available type 3 powder. excellent response to pause performance, generating less defects due to start up. 25mm (10 mil) circles at high print speeds (based upon a 0. 5mm (20 mil) pitch flip-chip and 0201 assembly. Features & benefits alpha om-6106 is suitable for ultra-fine pitch applications such as 0. The alpha om-6106 activation system has been optimized to enhance joint solderability, solderballs and other soldering defects while maintaining long term reliability. The flux vehicle is rheologically formulated to provide excellent ultra-fine pitch and highspeed printing properties. This will prevent moisture condensation build up in the solder paste.Īlpha® om-6106 ultra-fine pitch solder paste description alpha om-6106, is a low residue, no-clean solder paste designed to maximize smt line throughput and yields. ALPHA OM-338 should be permitted to reach room temperature before unsealing its package prior to use (see handling procedures on page 2). STORAGE ALPHA OM-338 should be stored in a refrigerator upon receipt at 0 to 10☌ (32-50☏). Consult the MSDS for additional safety information. These vapors should be adequately exhausted from the work area. SAFETY While the ALPHA OM-338 flux system is not considered toxic, its use in typical reflow will generate a small amount of reaction and decomposition vapors. The reflow process window will give high soldering yield with good cosmetics and minimized rework. The higher the print speed employed, the higher the blade pressure that is required. Blade pressures should be 0.16-0.34 kg/cm of blade (0.9 -2Ibs/inch), depending upon the print speed. Lead Free: Complies with RoHS Directive 2002/95/EC.ĪPPLICATION Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 200mm/sec (8”/sec), with stencil thickness of 0.100mm (0.004”) to 0.150mm (0.006”), particularly when used in conjunction with ALPHA® Stencils. Flux Gel: OM-338 Flux Gel is available in 10cc and 30cc syringes for rework applications. Powder Size: Type 3, (25-45μm per IPC J-STD-005) and Type 4 (20-38μm per IPC J-STD-005) – Residues: Approximately 5% by (w/w) Packaging Sizes: 500 gram jars, 6” & 12” cartridges, DEK ProFlow TM cassettes, and 10cc and 30cc dispense syringes. Compatible with either nitrogen or air reflow PRODUCT INFORMATION Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) SAC387 (95.5%Sn/3.8%Ag/0.7%Cu) SAC396 (95.5%Sn/3.9%Ag/0.6%Cu) SAC405 (95.5%Sn/4.0%Ag/0.5%Cu) SACXTM e1 alloys per JESD97 Classification For other alloys, contact your local Cookson Electronics Sales Office.Excellent reliability properties, halide-free material.Meets highest IPC 7095 voiding performance classification of Class III.Reduction in random solderballing levels, minimizing rework and increasing first time yield.Excellent solder and flux cosmetics after reflow soldering.Wide reflow profile window with good solderability on various board / component finishes.Print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a high throughput.Excellent print consistency with high process capability index across all board designs.Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”) with 0.100mm (4mil) stencil thickness.Additionally, ALPHA OM-338’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability. ALPHA OM-338 is formulated to deliver excellent visual joint cosmetics. Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, exceptional random solder ball resistance and mid-chip solder ball performance. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications. ALPHA OM-338’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. ALPHA® OM-338 Series ULTRA FINE FEATURE LEAD-FREE SOLDER PASTE DESCRIPTION ALPHA OM-338 is a lead-free, no-clean solder paste designed for a broad range of applications.
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |